Keywords:extreme temperatures; high density CCGA qualifications; CCGA reliabiilty; solder joint failures; optical inspections
Publisher:Pasadena, CA : Jet Propulsion Laboratory, National Aeronautics and Space Administration, 2012.
Citation:SPIE Photonics West, San Francisco, California, January 21-26, 2012
Abstract:
This paper provides the experimental test results of advanced CCGA packages tested in extreme temperature thermal environments. Standard optical inspection and x-ray non-destructive inspection tools were used to assess the reliability of high density CCGA packages for deep space extreme temperature missions.