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Reliability of high I/O high density CCGA interconnect electronic packages under extreme thermal environments

Reliability of high I/O high density CCGA interconnect electronic packages under extreme thermal environments

Ramesham, Rajeshuni
URI: http://hdl.handle.net/2014/42706
Date: 2012-01-22
Keywords: extreme temperatures; high density CCGA qualifications; CCGA reliabiilty; solder joint failures; optical inspections
Publisher: Pasadena, CA : Jet Propulsion Laboratory, National Aeronautics and Space Administration, 2012.
Citation: SPIE Photonics West, San Francisco, California, January 21-26, 2012

Abstract:

This paper provides the experimental test results of advanced CCGA packages tested in extreme temperature thermal environments. Standard optical inspection and x-ray non-destructive inspection tools were used to assess the reliability of high density CCGA packages for deep space extreme temperature missions.

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