JPL Technical Report Server

BOK─Mechanical Methods for Array Package/Assembly

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dc.contributor.author Ghaffarian, Reza
dc.date.accessioned 2012-10-12T20:48:47Z
dc.date.available 2012-10-12T20:48:47Z
dc.date.issued 2012-09
dc.identifier.uri http://hdl.handle.net/2014/42320
dc.description.abstract Commercial-off-the-shelf area array package technologies in high-reliability versions are being considered for NASA electronic systems. These packages are prone to early failure due to the severe mechanical shock and vibration of launch, as well as other less severe conditions, such as mechanical loading during descent, rough terrain mobility, handling, and ground tests. As the density of these packages increases and the size of ball interconnections decrease, susceptibility to mechanical loading and cycling fatigue grows. This report presents a summary of the body of knowledge developed for the evaluation of area array packages and is based on surveys of literature from industry and academia. For high-reliability applications, the limited data that exists will be presented. Most data from industry deals with mechanical fatigue caused by four-point bend tests, as well as from drop tests for hand-held electronics; the most recent data will be presented, along with a brief background of prior literature. Understanding the key design guidelines and failure mechanisms from past tests is critical to developing an approach that will minimize future failures. Additional specific testing enables low-risk insertion of these advanced electronic packages. en_US
dc.description.sponsorship NASA/JPL en_US
dc.language.iso en_US en_US
dc.publisher Pasadena, CA : Jet Propulsion Laboratory, National Aeronautics and Space Administration, 2012. en_US
dc.relation.ispartofseries JPL Publication en_US
dc.relation.ispartofseries 12-14 en_US
dc.subject Solder joint reliability en_US
dc.subject mechanical fatigue en_US
dc.subject drop en_US
dc.subject vibration en_US
dc.subject flip-chip ball grid array (FCBGA) en_US
dc.title BOK─Mechanical Methods for Array Package/Assembly en_US
dc.type Technical Report en_US
dc.subject.NASATaxonomy Quality Assurance and Reliability en_US
dc.subject.NASATaxonomy Physics en_US


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