Persistent Identifier
|
hdl:2014/42283 |
Publication Date
|
2011-03-03 |
Title
| Terahertz array receivers with integrated antennas |
Author
| Chattopadhyay, Goutam (Pasadena, CA : Jet Propulsion Laboratory, National Aeronautics and Space Administration, 2012.)
Llombart, Nuria (Pasadena, CA : Jet Propulsion Laboratory, National Aeronautics and Space Administration, 2012.)
Lee, Choonsup (Pasadena, CA : Jet Propulsion Laboratory, National Aeronautics and Space Administration, 2012.)
Jung, Cecile (Pasadena, CA : Jet Propulsion Laboratory, National Aeronautics and Space Administration, 2012.)
Lin, Robert (Pasadena, CA : Jet Propulsion Laboratory, National Aeronautics and Space Administration, 2012.)
Cooper, Ken B. (Pasadena, CA : Jet Propulsion Laboratory, National Aeronautics and Space Administration, 2012.)
Reck, Theodore (Pasadena, CA : Jet Propulsion Laboratory, National Aeronautics and Space Administration, 2012.)
Siles, Jose (Pasadena, CA : Jet Propulsion Laboratory, National Aeronautics and Space Administration, 2012.)
Schlecht, Erich (Pasadena, CA : Jet Propulsion Laboratory, National Aeronautics and Space Administration, 2012.)
Peralta, Alessandro (Pasadena, CA : Jet Propulsion Laboratory, National Aeronautics and Space Administration, 2012.)
Thomas, Bertrand (Pasadena, CA : Jet Propulsion Laboratory, National Aeronautics and Space Administration, 2012.)
Mehdi, Imran (Pasadena, CA : Jet Propulsion Laboratory, National Aeronautics and Space Administration, 2012.) |
Point of Contact
|
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Chattopadhyay, Goutam |
Description
| Highly sensitive terahertz heterodyne receivers have been mostly single-pixel. However, now there is a real need of multi-pixel array receivers at these frequencies driven by the science and instrument requirements. In this paper we explore various receiver font-end and antenna architectures for use in multi-pixel integrated arrays at terahertz frequencies. Development of wafer-level integrated terahertz receiver front-end by using advanced semiconductor fabrication technologies has progressed very well over the past few years. Novel stacking of micro-machined silicon wafers which allows for the 3-dimensional integration of various terahertz receiver components in extremely small packages has made it possible to design multi-pixel heterodyne arrays. One of the critical technologies to achieve fully integrated system is the antenna arrays compatible with the receiver array architecture. In this paper we explore different receiver and antenna architectures for multi-pixel heterodyne and direct detector arrays for various applications such as multi-pixel high resolution spectrometer and imaging radar at terahertz frequencies. |
Subject
| Other |
Production Date
| 2011-03-03 |