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Evaluation methodology guidance for stack packages

Show simple item record Ghaffarian, Reza Gerke, David 2010-11-10T17:28:46Z 2010-11-10T17:28:46Z 2009-10
dc.description.abstract This report provides evaluation methodology guidance based on previous National Aeronautics and Space Administration (NASA) reports and literature surveys for 3D stack packages and assemblies. Two aspects of technology are covered: the package itself (guidance for functional packages) and package assembly manufacturing and reliability. This work was funded by the NASA Electronic Parts and Packaging (NEPP) Program. The objectives of this NEPP project are to: Perform a literature survey of 3D stack technology; perform a literature survey on the evaluation methodology for 3D package and assembly; combine the two aspects to provide evaluation methodology for both aspects with consideration of interactions between package and assembly; generate guidance on the evaluation methodology for 3D stack package integrity prior to and after assembly; provide recommendations on future experimental activities. The qualification and evaluation methodology guidelines will facilitate NASA projects in effectively evaluating the reliability of very dense and newly available high-density 3D stack packages, allowing more processing power in a smaller board footprint and lower system weight. en_US
dc.description.sponsorship NASA/JPL en_US
dc.language.iso en_US en_US
dc.publisher Pasadena, CA : Jet Propulsion Laboratory, National Aeronautics and Space Administration, 2009 en_US
dc.relation.ispartofseries JPL Publication en_US
dc.relation.ispartofseries 09-23 en_US
dc.subject 3D stack package en_US
dc.subject advanced electronic packages en_US
dc.subject through silicon via (TSV) en_US
dc.subject reliability en_US
dc.subject characterization en_US
dc.subject microelectronics en_US
dc.title Evaluation methodology guidance for stack packages en_US
dc.type Technical Report en_US

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