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Reliability of recolumned area array packages

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dc.contributor.author Ghaffarian, Reza
dc.date.accessioned 2009-10-05T14:45:40Z
dc.date.available 2009-10-05T14:45:40Z
dc.date.issued 2009-03
dc.identifier.uri http://hdl.handle.net/2014/41404
dc.description.abstract This report presents qualification guidelines developed for recolumned, high I/O ceramic column grid array (CCGA) packages assembled onto printed wiring/circuit boards (PWBs/PCBs). It includes recolumn and assembly process development for two types of CCGA packages: those with and those without interposer. Thermal cycle test results and photomicrographs showing damage progress for recolumned CCGA assemblies are documented and presented. en_US
dc.description.sponsorship NASA/JPL en_US
dc.language.iso en_US en_US
dc.publisher Pasadena, CA : Jet Propulsion Laboratory, National Aeronautics and Space Administration, 2009. en_US
dc.relation.ispartofseries JPL Publication en_US
dc.relation.ispartofseries 09-11 en_US
dc.subject radiation en_US
dc.subject array packages en_US
dc.subject photomicrographs en_US
dc.subject thermal tests en_US
dc.title Reliability of recolumned area array packages en_US
dc.type Technical Report en_US


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