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Thermal cycle reliability and failure mechanisms of CCGA and PBGA assemblies with and without corner staking

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dc.contributor.author Ghaffarian, Reza
dc.date.accessioned 2009-09-24T22:28:53Z
dc.date.available 2009-09-24T22:28:53Z
dc.date.issued 2008-06-02
dc.identifier.citation Transactions On Components And Packaging Technologies, Vol. 31, No. 2, June 2008, doi:10.1109/TCAPT.2008.921626 en_US
dc.identifier.clearanceno 05-0240
dc.identifier.uri http://hdl.handle.net/2014/41399
dc.description.abstract Area array packages (AAPs) with 1.27 mm pitch have been the packages of choice for commercial applications; they are now starting to be implemented for use in military and aerospace applications. Thermal cycling characteristics of plastic ball grid array (PBGA) and chip scale package assemblies, because of their wide usage for commercial applications, have been extensively reported on in literature. Thermal cycling represents the on-off environmental condition for most electronic products and therefore is a key factor that defines reliability. However, very limited data is available for thermal cycling behavior of ceramic packages commonly used for the aerospace applications. For high reliability applications, numerous AAPs are available with an identical design pattern both in ceramic and plastic packages. This paper compares assembly reliability of ceramic and plastic packages with the identical inputs/outputs (I/Os) and pattern. The ceramic package was in the form of ceramic column grid array (CCGA) with 560 I/Os peripheral array with the identical pad design as its plastic counterpart. en_US
dc.description.sponsorship NASA/JPL en_US
dc.language.iso en_US en_US
dc.publisher IEEE en_US
dc.subject ball grid array (BGA) en_US
dc.subject ceramic column grid array (CGA) en_US
dc.subject column grid array (CGA) en_US
dc.subject inspection en_US
dc.subject plastic ball grid array (PBGA) en_US
dc.subject solder joint en_US
dc.subject stake en_US
dc.subject thermal cycle en_US
dc.title Thermal cycle reliability and failure mechanisms of CCGA and PBGA assemblies with and without corner staking en_US
dc.type Article en_US


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