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Ultra-thin, flexible electronics

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dc.contributor.author Holland, Brian
dc.contributor.author Mcpherson, Ryan
dc.contributor.author Zhang, Tan
dc.contributor.author Hou, Zhenwei
dc.contributor.author Dean, Robert
dc.contributor.author Johnson, R. Wayne
dc.contributor.author Del Castillo, Linda
dc.contributor.author Moussessian, Alina
dc.date.accessioned 2009-06-30T20:26:55Z
dc.date.available 2009-06-30T20:26:55Z
dc.date.issued 2008-05-17
dc.identifier.citation Electronic Components and Technology Conference, 2008. ECTC 2008. 58th, May 27-30, 2008, doi: 10.1109/ECTC.2008.4550114 en_US
dc.identifier.clearanceno 09-0695
dc.identifier.uri http://hdl.handle.net/2014/41337
dc.description.abstract Thinned die can be used to realize ultra-thin flexible electronics for applications such as conformal and wearable electronics. Three techniques have been developed to achieve this goal using thinned die: die flip chip bonded onto flexible substrates, die laminated onto LCP films, and die embedded in polyimide. A key to achieving each of these techniques is the thinning of die to a thickness of 50 mum or thinner. Conventional CMP processing can be used to thin to 50 mum. At 50 mum, the active die become flexible and must be handled by temporarily bonding them to a holder die, for further processing. Once bonded face down to the holder die, the active die can be further thinned by DRIE etching the exposed backside. The thinned die can then been packaged in or on the flexible substrate. en_US
dc.description.sponsorship NASA/JPL en_US
dc.language.iso en_US en_US
dc.publisher IEEE en_US
dc.subject bonding processes en_US
dc.subject electronics packaging en_US
dc.subject flexible electronics en_US
dc.subject flip chip devices en_US
dc.title Ultra-thin, flexible electronics en_US
dc.type Article en_US


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