JPL Technical Report Server

Re-configurable electronics characterization under extreme thermal environment

Show simple item record

dc.contributor.author Stoica, Adrian
dc.contributor.author Lacayo, Veronica
dc.contributor.author Ramesham, Rajeshuni
dc.contributor.author Keymeulen, Didier
dc.contributor.author Zebulum, Ricardo
dc.contributor.author Neff, Joe
dc.contributor.author Burke, Gary
dc.contributor.author Daud, Taher
dc.date.accessioned 2009-03-09T16:49:15Z
dc.date.available 2009-03-09T16:49:15Z
dc.date.issued 2005-09-07
dc.identifier.citation Military and Aerospace Programmable Logic Devices (MAPLD) International Conference, San Diego, California, September 7-9, 2005 en_US
dc.identifier.clearanceno 05-2389
dc.identifier.uri http://hdl.handle.net/2014/41124
dc.description.sponsorship NASA/JPL en_US
dc.language.iso en_US en_US
dc.publisher Pasadena, CA : Jet Propulsion Laboratory, National Aeronautics and Space Administration, 2005. en_US
dc.subject extreme environments en_US
dc.subject reliability en_US
dc.subject reconfigurable en_US
dc.subject FPGA en_US
dc.subject Digital Signal Processor (DSP) en_US
dc.title Re-configurable electronics characterization under extreme thermal environment en_US
dc.type Presentation en_US


Files in this item

This item appears in the following Collection(s)

Show simple item record

Search


Browse

My Account