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Effects of hand soldering MIL-PRF 55365 tantalum capacitors

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dc.contributor.author Reed, Erik K.
dc.contributor.author Spence, Penelope L.
dc.contributor.author Sheldon, Douglas
dc.date.accessioned 2008-05-13T22:08:01Z
dc.date.available 2008-05-13T22:08:01Z
dc.date.issued 2008-03
dc.identifier.uri http://hdl.handle.net/2014/40794
dc.description.abstract Different values of MIL-PRF-55365 tantalum capacitors were subjected to three different types of soldering conditions— Convection Reflow, JPL Standard Hand Soldering, and Optimized Hand Soldering. The electrical parameters for a large number of capacitors of each value were measured before and after thermal soldering stress. The results indicate that tantalum capacitors subjected to convection reflow conditions experience detectable changes in electrical parameters; capacitors subjected to hand solder conditions show reduced changes in electrical parameters when compared to the reflow samples. Optimized hand solder conditions are shown to have a minimal effect on electrical parameters. en_US
dc.description.sponsorship NASA/JPL en_US
dc.language.iso en_US en_US
dc.publisher Pasadena, CA : Jet Propulsion Laboratory, National Aeronautics and Space Administration, 2008. en_US
dc.relation.ispartofseries JPL Publication en_US
dc.relation.ispartofseries 08-12 en_US
dc.subject thermal stress en_US
dc.subject hand soldering en_US
dc.title Effects of hand soldering MIL-PRF 55365 tantalum capacitors en_US
dc.type Technical Report en_US


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