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Thermal cycle reliability of PBGA/CCGA 717 I/Os

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dc.contributor.author Ghaffarian, Reza
dc.date.accessioned 2008-02-07T19:38:46Z
dc.date.available 2008-02-07T19:38:46Z
dc.date.issued 2006-05-30
dc.identifier.citation IEEE 56th Electronic Components and Technology Conference, San Diego, California, May 30 - June 2, 2006. en
dc.identifier.clearanceno 06-0270
dc.identifier.uri http://hdl.handle.net/2014/40658
dc.description.abstract Status of thermal cycle test results for a nonfunctional daisy-chained peripheral ceramic column grid array (CCGA) and its plastic ball grid array (PRGA) version. both having 560 1/0s. were presented in last year's conference. Test results included environmental data for three different thermal cycle regimes (-55°/125°C, -55°C/100°C, and -50° /75°C). Update information on these - especially failure type for assemblies with high and low solder volumes-were presented. The thermal cycle test procedure followed those recommended IPC-9701 for tin-lead solder joint assemblies. Revision A of this specification covers guideline thermal cycle requirements for Pb-free solder joints. Some background information discussed during release of this specification with its current guideline recommendations were also presented. en
dc.description.sponsorship NASA/JPL en
dc.format.extent 5279634 bytes
dc.format.mimetype application/pdf
dc.language.iso en_US en
dc.publisher Pasadena, CA : Jet Propulsion Laboratory, National Aeronautics and Space Administration, 2006. en
dc.subject ceramic column grid array (CCGA) en
dc.subject plastic ball grid array (PBGA) en
dc.subject thermal cycle en
dc.subject staking en
dc.subject solder joint en
dc.subject inspection en
dc.subject conformal coat en
dc.subject corner staking en
dc.title Thermal cycle reliability of PBGA/CCGA 717 I/Os en
dc.type Preprint en


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