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Extreme temperature electronics using a reconfigurable analog array

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dc.contributor.author Zebulum, Ricardo S.
dc.contributor.author Rejeshuni, Ramesham
dc.contributor.author Keymeulen, Didier
dc.contributor.author Daud, Taher
dc.contributor.author Neff, Joseph
dc.contributor.author Stoica, Adrian
dc.date.accessioned 2007-04-06T16:41:20Z
dc.date.available 2007-04-06T16:41:20Z
dc.date.issued 2006-03-04
dc.identifier.citation IEEE Aerospace Conference, Big Sky, Montana, March 4-11, 2006. en
dc.identifier.clearanceno 05-3462
dc.identifier.uri http://hdl.handle.net/2014/40193
dc.description.abstract Temperature and radiation tolerant electronics, as well as long life survivability are key capabilities required for future NASA missions. Current approaches to electronics for extreme environments focus on component level robustness and hardening. Compensation techniques such as bias cancellation circuitry have also been employed. However, current technology can only ensure very limited lifetime in extreme environments. Previous work presented a novel approach, based on evolvable hardware technology, which allows adaptive in-situ circuit redesign/reconfiguration during operation in extreme environments. This technology would complement material/device advancements and increase the mission capability to survive harsh environments. This work describes a new reconfigurable analog chip developed by JPL and SPAWAR that is targeted for extreme temperature and evolutionary hardware experiments. Being based on Gm-C technology, this chip can have its functionality tuned and adapted to extreme temperatures through voltage bias adjustment. This tuning process will be controlled by Evolutionary Algorithms. This paper presents details of the reconfigurable analog chip as well as a system level overview. Some early experiments are also described. en
dc.description.sponsorship NASA/JPL en
dc.format.extent 1264059 bytes
dc.format.mimetype application/pdf
dc.language.iso en_US en
dc.publisher Pasadena, CA : Jet Propulsion Laboratory, National Aeronautics and Space Administration, 2006. en
dc.subject evolvable hardware en
dc.subject reconfigurable analog array (RAA) en
dc.subject extreme environments en
dc.title Extreme temperature electronics using a reconfigurable analog array en
dc.type Preprint en


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