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Lead-free vs tin-lead reliability of advanced electronic assemblies

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dc.contributor.author Ghaffarian, Reza
dc.date.accessioned 2007-03-13T22:59:35Z
dc.date.available 2007-03-13T22:59:35Z
dc.date.issued 2005-12-06
dc.identifier.citation Microelectronic Reliability on Quality Workshop, Manhattan Beach, California, December 6-7, 2005. en
dc.identifier.clearanceno 05-3714
dc.identifier.uri http://hdl.handle.net/2014/40172
dc.description.abstract This presentation will provide the technical background and specific information published in literature related to reliability test, analyses, modeling, and associated issues for lead-free solder package assemblies in comparison to their tin-lead solder alloys. It also presents current understanding of lead-free thermal cycle test performance in support en
dc.description.sponsorship NASA/JPL en
dc.format.extent 902432 bytes
dc.format.mimetype application/pdf
dc.language.iso en_US en
dc.publisher Pasadena, CA : Jet Propulsion Laboratory, National Aeronautics and Space Administration, 2005. en
dc.subject assembly reliability en
dc.subject solder
dc.subject board assembly
dc.title Lead-free vs tin-lead reliability of advanced electronic assemblies en
dc.type Preprint en


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