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Qualification and reliability for MEMS and IC packages

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dc.contributor.author Ghaffarian, Reza
dc.date.accessioned 2006-11-28T19:20:09Z
dc.date.available 2006-11-28T19:20:09Z
dc.date.issued 2004-09-26
dc.identifier.citation Surface Mount Technology Association (SMTA), Chicago, Illinois, September 26-30, 2004. en
dc.identifier.clearanceno 04-2474
dc.identifier.uri http://hdl.handle.net/2014/39978
dc.description.abstract This paper will review four standards that already released or being developed that specifically address the issues on qualification and reliability of assembled packages. Exposures to thermal cycles, monotonic bend test, mechanical shock and drop are covered in these specifications. Finally, mechanical and thermal cycle qualification data generated for MEMS accelerometer will be presented. The MEMS was an element of an inertial measurement unit (IMU) qualified for NASA Mars Exploration Rovers (MERs), Spirit and Opportunity that successfully is currently roaring the Martian surface. en
dc.description.sponsorship NASA/JPL en
dc.format.extent 2874526 bytes
dc.format.mimetype application/pdf
dc.language.iso en_US en
dc.publisher Pasadena, CA : Jet Propulsion Laboratory, National Aeronautics and Space Administration, 2004. en
dc.subject thermal cycles en
dc.subject solder joint en
dc.subject area array package en
dc.subject reliability en
dc.subject microelectromechanical systems (MEMS) en
dc.subject inertial measurement unit en
dc.subject Mars Exploration Rover (MER) en
dc.subject electronic packaging
dc.title Qualification and reliability for MEMS and IC packages en
dc.type Preprint en


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