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Reliability of CCGA and PBGA assemblies

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dc.contributor.author Ghaffarian, Reza
dc.date.accessioned 2006-07-31T17:32:37Z
dc.date.available 2006-07-31T17:32:37Z
dc.date.issued 2005-02-22
dc.identifier.citation APEX- Electronic Circuites World Conference, Anaheim, California, February 22-24, 2005. en
dc.identifier.clearanceno APEX Electronic Circuites World Conference, Anaheim, California, February 22-24, 2005.
dc.identifier.clearanceno 04-3878
dc.identifier.uri http://hdl.handle.net/2014/39605
dc.description.abstract Area Array Packages (AAPs) with 1.27 mm pitch have been the packages of the choice for commercial applications; they are now started to be implemented for use in military and aerospace applications. Thermal cycling characteristics of plastic BGA (PBGA) and CSP assemblies, because of their wide usage for commercial applications, have been extensively reported in literature. Thermal cycling represents the on-off environmental condition for most electronic products and therefore is a key factor that defines reliability. en
dc.description.sponsorship NASA/JPL en
dc.format.extent 4556370 bytes
dc.format.mimetype application/pdf
dc.language.iso en_US en
dc.publisher Pasadena, CA : Jet Propulsion Laboratory, National Aeronautics and Space Administration, 2005 en
dc.subject ball grid array (BGA) en
dc.subject PBGA en
dc.subject thermal cycles en
dc.subject stakes en
dc.subject solder joints en
dc.subject column grid array (CCGA) en
dc.subject inspections en
dc.subject area array packages en
dc.title Reliability of CCGA and PBGA assemblies en
dc.type Preprint en


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