Publisher:Pasadena, CA : Jet Propulsion Laboratory, National Aeronautics and Space Administration, 2005
Citation:APEX- Electronic Circuites World Conference, Anaheim, California, February 22-24, 2005.
Abstract:
Area Array Packages (AAPs) with 1.27 mm pitch have been the packages of the choice for commercial applications; they are now started to be implemented for use in military and aerospace applications. Thermal cycling characteristics of plastic BGA (PBGA) and CSP assemblies, because of their wide usage for commercial applications, have been extensively reported in literature. Thermal cycling represents the on-off environmental condition for most electronic products and therefore is a key factor that defines reliability.
