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Capturing a failure of an ASIC in-situ, using infrared radiometry and image processing software.

Show simple item record Ruiz, Ronald P. 2006-04-12T17:28:26Z 2006-04-12T17:28:26Z 2003-10-13
dc.identifier.citation Information Thermographers Conference, Las Vegas, Nevada, October 13-16, 2003. en
dc.identifier.clearanceno 03-2512
dc.description.abstract Failures in electronic devices can sometimes be tricky to locate-especially if they are buried inside radiation-shielded containers designed to work in outer space. Such was the case with a malfunctioning ASIC (Application Specific Integrated Circuit) that was drawing excessive power at a specific temperature during temperature cycle testing. To analyze the failure, infrared radiometry (thermography) was used in combination with image processing software to locate precisely where the power was being dissipated at the moment the failure took place. The IR imaging software was used to make the image of the target and background, appear as unity. As testing proceeded and the failure mode was reached, temperature changes revealed the precise location of the fault. The results gave the design engineers the information they needed to fix the problem. This paper describes the techniques and equipment used to accomplish this failure analysis. en
dc.description.sponsorship NASA/JPL en
dc.format.extent 1525903 bytes
dc.format.mimetype application/pdf
dc.language.iso en_US en
dc.publisher Pasadena, CA : Jet Propulsion Laboratory, National Aeronautics and Space Administration, 2003. en
dc.subject infrared en
dc.subject Application Specific Integrated Circuit (ASIC) en
dc.subject imaging subraction software en
dc.subject radiometry en
dc.subject in-situ en
dc.title Capturing a failure of an ASIC in-situ, using infrared radiometry and image processing software. en
dc.type Preprint en

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