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Impact of junction temperature on microelectronic device reliability and considerations for space applications

Impact of junction temperature on microelectronic device reliability and considerations for space applications

White, Mark; Chen, Yuan; Cooper, Mark
URI: http://hdl.handle.net/2014/38512
Date: 2003-10
Keywords: junction temperature; device reliability
Publisher: Pasadena, CA : Jet Propulsion Laboratory, National Aeronautics and Space Administration, 2005.
Citation: IEEE International Integrated Reliability Workshop, Lake Tahoe, NV, October 20-24, 2003

Abstract:

This paper provides a summary of an industry survey on junction temperature derating from key microelectronics suppliers, and offers recommendations to users for temperature derating for reliable operation over time. Background information on established derating factors, and reccommendations for safe operating junction temperatures for newer technologies are also presented.

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