Electronic packaging for extended Mars surface missions

Shapiro, Andrew A.; Ling, Sharon X.; Ganesan, Sanka; Cozy, R. Scott; Hunter, Donald J.; Schatzel, Donald V.; Mojarradi, Mohammad M.

dc.contributor.author	Shapiro, Andrew A.
dc.contributor.author	Ling, Sharon X.
dc.contributor.author	Ganesan, Sanka
dc.contributor.author	Cozy, R. Scott
dc.contributor.author	Hunter, Donald J.
dc.contributor.author	Schatzel, Donald V.
dc.contributor.author	Mojarradi, Mohammad M.
dc.date.accessioned	2005-12-01T23:54:44Z
dc.date.available	2005-12-01T23:54:44Z
dc.date.issued	2004-03
dc.identifier.citation	IEEE Aerospace Conference, Big Sky, MT, March 2004	en
dc.identifier.clearanceno	03-3098
dc.identifier.uri	http://hdl.handle.net/2014/38188
dc.description.abstract	Extended Mars missions will require vehicles to survive a large number of extended temperature cycles. To address this issue for electronics, previous strategies have been to locate critical electronics in a "warm electronics box" where thermal management is more easily maintained. However, that strategy limits the number and location of electronics. An alternative strategy allows electronics to be remotely located on actuator and wheel arms with no heating which has the advantage of distributed control.	en
dc.description.sponsorship	NASA	en
dc.format.extent	5574425 bytes
dc.format.mimetype	application/pdf
dc.language.iso	en_US	en
dc.publisher	Pasadena, CA : Jet Propulsion Laboratory, National Aeronautics and Space Administration, 2004.	en
dc.subject	electronics	en
dc.subject	packaging	en
dc.subject	chip-on-board	en
dc.subject	thermal cycle	en
dc.title	Electronic packaging for extended Mars surface missions	en
dc.type	Preprint	en