JPL Technical Report Server

Electronic packaging for extended Mars surface missions

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dc.contributor.author Shapiro, Andrew A.
dc.contributor.author Ling, Sharon X.
dc.contributor.author Ganesan, Sanka
dc.contributor.author Cozy, R. Scott
dc.contributor.author Hunter, Donald J.
dc.contributor.author Schatzel, Donald V.
dc.contributor.author Mojarradi, Mohammad M.
dc.date.accessioned 2005-12-01T23:54:44Z
dc.date.available 2005-12-01T23:54:44Z
dc.date.issued 2004-03
dc.identifier.citation IEEE Aerospace Conference, Big Sky, MT, March 2004 en
dc.identifier.clearanceno 03-3098
dc.identifier.uri http://hdl.handle.net/2014/38188
dc.description.abstract Extended Mars missions will require vehicles to survive a large number of extended temperature cycles. To address this issue for electronics, previous strategies have been to locate critical electronics in a "warm electronics box" where thermal management is more easily maintained. However, that strategy limits the number and location of electronics. An alternative strategy allows electronics to be remotely located on actuator and wheel arms with no heating which has the advantage of distributed control. en
dc.description.sponsorship NASA en
dc.format.extent 5574425 bytes
dc.format.mimetype application/pdf
dc.language.iso en_US en
dc.publisher Pasadena, CA : Jet Propulsion Laboratory, National Aeronautics and Space Administration, 2004. en
dc.subject electronics en
dc.subject packaging en
dc.subject chip-on-board en
dc.subject thermal cycle en
dc.title Electronic packaging for extended Mars surface missions en
dc.type Preprint en


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