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Reliability assessment of advanced flip-chip interconnect electronic package assemblies under extreme cold temperatures (-190 degrees C and -120 degrees C)

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dc.contributor.author Ramesham, Rajeshuni
dc.contributor.author Ghaffarian, Reza en_US
dc.contributor.author Shapiro, Andrew en_US
dc.contributor.author Napala, Phil A. en_US
dc.contributor.author Martin, Patrick A. en_US
dc.date.accessioned 2005-09-29T21:11:54Z
dc.date.available 2005-09-29T21:11:54Z
dc.date.issued 2005-02
dc.identifier Reliability of Advanced Electronic Packages and Device In Extreme Cold Environments, Pasadena, CA, February 21-23, 2005
dc.identifier.citation Reliability of Advanced Electronic Packages and Device In Extreme Cold Environments, Pasadena, CA, February 21-23, 2005 en
dc.identifier.clearanceno 05-0551
dc.identifier.uri http://hdl.handle.net/2014/37569
dc.description.sponsorship NASA en
dc.format.extent 2802301 bytes
dc.format.mimetype application/pdf
dc.language.iso en_US en
dc.publisher Pasadena, CA : Jet Propulsion Laboratory, National Aeronautics and Space Administration, 2005. en
dc.subject extreme temperatures en
dc.subject reliability en
dc.subject flip chip en
dc.subject thermal cycling en
dc.title Reliability assessment of advanced flip-chip interconnect electronic package assemblies under extreme cold temperatures (-190 degrees C and -120 degrees C) en
dc.type Presentation en


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