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Electrical and structural investigation of the effects of via-conductor geometry in the electromigration of AL:CU

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dc.contributor.author Leon, R. en_US
dc.contributor.author Vu, D. en_US
dc.contributor.author Johnson, A. S. en_US
dc.contributor.author Ruiz, R. en_US
dc.contributor.author Okuno, J. en_US
dc.contributor.author Uribe, J. en_US
dc.contributor.author Hather, G. en_US
dc.contributor.author Lloyd, . R. en_US
dc.date.accessioned 2004-11-09T21:47:47Z
dc.date.available 2004-11-09T21:47:47Z
dc.date.issued 2001-11 en_US
dc.identifier.citation Fall Meeting of the Materials Research Society en_US
dc.identifier.citation Boston, MA, USA en_US
dc.identifier.clearanceno 01-2572
dc.identifier.uri http://hdl.handle.net/2014/36900
dc.description.abstract Electromigration experiments, their results at different densities. en_US
dc.format.extent 44669 bytes
dc.format.mimetype application/pdf
dc.language.iso en_US
dc.subject.other AL:CU electromigration failure analysis en_US
dc.title Electrical and structural investigation of the effects of via-conductor geometry in the electromigration of AL:CU en_US


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