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Rapid qualification of CSP assemblies by increase of ramp rates and cycling temperature ranges

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dc.contributor.author Ghaffarian, R. en_US
dc.contributor.author Kim, N.
dc.contributor.author Rose, D.
dc.contributor.author Hunter, B.
dc.contributor.author Devitt, K.
dc.contributor.author Long, T.
dc.date.accessioned 2004-11-09T21:36:04Z
dc.date.available 2004-11-09T21:36:04Z
dc.date.issued 2001-09-01 en_US
dc.identifier.citation Surface Mount Technology Association en_US
dc.identifier.citation Chicago, IL, USA en_US
dc.identifier.clearanceno 01-1692 en_US
dc.identifier.uri http://hdl.handle.net/2014/36837
dc.description.abstract Team members representing government agencies and private companies have joined together to pool in-kind resources for developing the quality and reliability of chip scale packages (CSPs) for a variety of projects. en_US
dc.format.extent 1046707 bytes
dc.format.mimetype application/pdf
dc.language.iso en_US
dc.subject.other chip scale package solder joint reliability BGA thermal cycle ramp rate en_US
dc.title Rapid qualification of CSP assemblies by increase of ramp rates and cycling temperature ranges en_US


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