Rapid qualification of CSP assemblies by increase of ramp rates and cycling temperature ranges

Ghaffarian, R.; Kim, N.; Rose, D.; Hunter, B.; Devitt, K.; Long, T.

dc.contributor.author	Ghaffarian, R.	en_US
dc.contributor.author	Kim, N.
dc.contributor.author	Rose, D.
dc.contributor.author	Hunter, B.
dc.contributor.author	Devitt, K.
dc.contributor.author	Long, T.
dc.date.accessioned	2004-11-09T21:36:04Z
dc.date.available	2004-11-09T21:36:04Z
dc.date.issued	2001-09-01	en_US
dc.identifier.citation	Surface Mount Technology Association	en_US
dc.identifier.citation	Chicago, IL, USA	en_US
dc.identifier.clearanceno	01-1692	en_US
dc.identifier.uri	http://hdl.handle.net/2014/36837
dc.description.abstract	Team members representing government agencies and private companies have joined together to pool in-kind resources for developing the quality and reliability of chip scale packages (CSPs) for a variety of projects.	en_US
dc.format.extent	1046707 bytes
dc.format.mimetype	application/pdf
dc.language.iso	en_US
dc.subject.other	chip scale package solder joint reliability BGA thermal cycle ramp rate	en_US
dc.title	Rapid qualification of CSP assemblies by increase of ramp rates and cycling temperature ranges	en_US