dc.contributor.author |
Ghaffarian, R. |
en_US |
dc.contributor.author |
Kim, N. |
|
dc.contributor.author |
Rose, D. |
|
dc.contributor.author |
Hunter, B. |
|
dc.contributor.author |
Devitt, K. |
|
dc.contributor.author |
Long, T. |
|
dc.date.accessioned |
2004-11-09T21:36:04Z |
|
dc.date.available |
2004-11-09T21:36:04Z |
|
dc.date.issued |
2001-09-01 |
en_US |
dc.identifier.citation |
Surface Mount Technology Association |
en_US |
dc.identifier.citation |
Chicago, IL, USA |
en_US |
dc.identifier.clearanceno |
01-1692 |
en_US |
dc.identifier.uri |
http://hdl.handle.net/2014/36837 |
|
dc.description.abstract |
Team members representing government agencies and private companies have joined together to pool in-kind resources for developing the quality and reliability of chip scale packages (CSPs) for a variety of projects. |
en_US |
dc.format.extent |
1046707 bytes |
|
dc.format.mimetype |
application/pdf |
|
dc.language.iso |
en_US |
|
dc.subject.other |
chip scale package solder joint reliability BGA thermal cycle ramp rate |
en_US |
dc.title |
Rapid qualification of CSP assemblies by increase of ramp rates and cycling temperature ranges |
en_US |