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Rapid qualification of CSP assemblies by increase of ramp rates and cycling temperature ranges

Rapid qualification of CSP assemblies by increase of ramp rates and cycling temperature ranges

Ghaffarian, R.; Kim, N.; Rose, D.; Hunter, B.; Devitt, K.; Long, T.
URI: http://hdl.handle.net/2014/36837
Date: 2001-09-01
Citation: Surface Mount Technology Association
Chicago, IL, USA

Abstract:

Team members representing government agencies and private companies have joined together to pool in-kind resources for developing the quality and reliability of chip scale packages (CSPs) for a variety of projects.

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