JPL Technical Report Server

(abstract) Electronic Packaging for Microspacecraft Applications

Show simple item record Wasler, David en_US 2004-10-06T03:56:29Z 2004-10-06T03:56:29Z 1993-03-29 en_US
dc.identifier.citation Pasadena, CA en_US
dc.identifier.clearanceno 93-1230 en_US
dc.description.abstract The intent of this presentation is to give a brief look into the future of electronic packaging for microspacecraft applications. Advancements in electronic packaging technology areas have developed to the point where a system engineer's visions, concepts, and requirements for a microspacecraft can now be a reality. These new developments are ideal candidates for microspacecraft applications. These technologies are capable of bringing about major changes in how we design future spacecraft while taking advantage of the benefits due to size, weight, power, performance, reliability , and cost. This presentation will also cover some advantages and limitations of surface mount technology (SMT), multichip modules (MCM), and wafer scale integration (WSI), and what is needed to implement these technologies into microspacecraft. en_US
dc.format.extent 8443 bytes
dc.format.mimetype application/pdf
dc.language.iso en_US
dc.subject.other microspacecraft electronic packaging systems engineering surface mount technology multichip modules wafer scale integration spacecraft design en_US
dc.title (abstract) Electronic Packaging for Microspacecraft Applications en_US

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