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Mechanical Stress Effects on Electromigration Voiding in a Meandering Test Stripe

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dc.contributor.author Lowry, L. E. en_US
dc.contributor.author Tai, B. H. en_US
dc.contributor.author Mattila, J. en_US
dc.contributor.author Walsh, L. H. en_US
dc.date.accessioned 2004-10-06T02:29:33Z
dc.date.available 2004-10-06T02:29:33Z
dc.date.issued 1993-04 en_US
dc.identifier.citation San Francisco, California, USA en_US
dc.identifier.clearanceno 93-0837 en_US
dc.identifier.uri http://hdl.handle.net/2014/35257
dc.description.abstract Earlier experimental findings concluded that electromigratin voids in these meandering stripe test structures were not randomly distributed and that void nucleation frequenly occurred sub-surface at the metal/thermal oxide interface. en_US
dc.format.extent 181062 bytes
dc.format.mimetype application/pdf
dc.language.iso en_US
dc.subject.other mechanical stress metal/thermal oxide interface metal composition en_US
dc.title Mechanical Stress Effects on Electromigration Voiding in a Meandering Test Stripe en_US


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