JPL Technical Report Server

Crack Propagation in Solder Joints During Thermal-Mechanical Cycling

Show simple item record

dc.contributor.author Wen, R.G. Ross Jr. L.C. en_US
dc.date.accessioned 2004-10-06T01:55:25Z
dc.date.available 2004-10-06T01:55:25Z
dc.date.issued 1993-11-28 en_US
dc.identifier.citation New Orleans, LA, USA en_US
dc.identifier.clearanceno 93-0621 en_US
dc.identifier.uri http://hdl.handle.net/2014/35077
dc.format.extent 79946 bytes
dc.format.mimetype application/pdf
dc.language.iso en_US
dc.subject.other Solder Joints Thermal-Mechanical Cycling en_US
dc.title Crack Propagation in Solder Joints During Thermal-Mechanical Cycling en_US


Files in this item

This item appears in the following Collection(s)

Show simple item record

Search


Browse

My Account