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Below Band-Gap Laser Ablation of Diamond for Transmission Electron Microscopy

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dc.contributor.author George, T. en_US
dc.contributor.author Foote, M. C. en_US
dc.contributor.author Vasquez, R. P. en_US
dc.contributor.author Fortier, E. P. en_US
dc.contributor.author Posthill, J. B. en_US
dc.date.accessioned 2004-10-06T01:48:31Z
dc.date.available 2004-10-06T01:48:31Z
dc.date.issued 1993 en_US
dc.identifier.citation Applied Physics Letters en_US
dc.identifier.clearanceno 93-0556 en_US
dc.identifier.uri http://hdl.handle.net/2014/35039
dc.description.abstract A 248-nm excimer laser was used to thin naturally occurring type 1a diamond substrates at normal and glancing (22 deg) incidence. Perforation of a 250 micron thick substrate was achieved in about 15 minutes at normal incidence. Whilst the substrate thinned at glancing incidence was found to have large electron-transparent areas, that thinned at normal incidence required additional argon milling to achieve electron transparency. X-ray photoelectron spectroscopy of the back surface of the diamond failed to detect any graphite or glassy carbon, confirming that damage due to laser ablation occurs only at the incident surface. Samples prepared using this technique imaged in the transmission electron microscope were observed to have retained the nitrogen platelets en_US
dc.format.extent 311401 bytes
dc.format.mimetype application/pdf
dc.language.iso en_US
dc.title Below Band-Gap Laser Ablation of Diamond for Transmission Electron Microscopy en_US


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