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A High Frequency Electronic Packaging Technology

Show simple item record Herman, M. en_US Lowry, L. en_US Lee, K. en_US Kolawa, E. en_US Tulintseff, A. en_US Whitaker, S. Senturia J. en_US Piket-May, M. en_US Shalkhauser, K. en_US 2004-10-05T22:10:23Z 2004-10-05T22:10:23Z 1994--November en_US
dc.identifier.citation Washington, District of Columbia, USA en_US
dc.identifier.clearanceno 94-0655 en_US
dc.format.extent 99935 bytes
dc.format.mimetype application/pdf
dc.language.iso en_US
dc.subject.other digital and analog circuits high frequency packaging RF performance package material systems en_US
dc.title A High Frequency Electronic Packaging Technology en_US

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