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A High Frequency Electronic Packaging Technology

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dc.contributor.author Herman, M. en_US
dc.contributor.author Lowry, L. en_US
dc.contributor.author Lee, K. en_US
dc.contributor.author Kolawa, E. en_US
dc.contributor.author Tulintseff, A. en_US
dc.contributor.author Whitaker, S. Senturia J. en_US
dc.contributor.author Piket-May, M. en_US
dc.contributor.author Shalkhauser, K. en_US
dc.date.accessioned 2004-10-05T22:10:23Z
dc.date.available 2004-10-05T22:10:23Z
dc.date.issued 1994--November en_US
dc.identifier.citation Washington, District of Columbia, USA en_US
dc.identifier.clearanceno 94-0655 en_US
dc.identifier.uri http://hdl.handle.net/2014/33922
dc.format.extent 99935 bytes
dc.format.mimetype application/pdf
dc.language.iso en_US
dc.subject.other digital and analog circuits high frequency packaging RF performance package material systems en_US
dc.title A High Frequency Electronic Packaging Technology en_US


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