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Nondestructive Characterization of Adhesive Bonds from Guided Wave Data

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dc.contributor.author Mal, A. K. en_US
dc.contributor.author Lih, S-S. en_US
dc.contributor.author Bar-Cohen, Y. en_US
dc.date.accessioned 2004-10-04T22:25:51Z
dc.date.available 2004-10-04T22:25:51Z
dc.date.issued 1994--February en_US
dc.identifier.citation Orlando, Florida, USA en_US
dc.identifier.clearanceno 94-0134 en_US
dc.identifier.uri http://hdl.handle.net/2014/32397
dc.description.abstract The critical role played by adhesive bonds in the fracture and failure of composites and other bonded materials is well known. A good knowledge of the mechanical properties of these adhesion joints is a prerequisite to reliable design and reliable prediction of the performance of these bonded structures. en_US
dc.format.extent 117481 bytes
dc.format.mimetype application/pdf
dc.language.iso en_US
dc.subject.other adhesively bonded joints ultrasonic nondestructive evaluation (NDE) elastic moduli en_US
dc.title Nondestructive Characterization of Adhesive Bonds from Guided Wave Data en_US


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