Taguchi Experimental Design for Cleaning PWAs with Ball Grid Arrays

Bonner, J.K.; Mehta, A.; Walton, S.

dc.contributor.author	Bonner, J.K.	en_US
dc.contributor.author	Mehta, A.	en_US
dc.contributor.author	Walton, S.	en_US
dc.date.accessioned	2004-10-01T06:15:25Z
dc.date.available	2004-10-01T06:15:25Z
dc.date.issued	1997-02-25	en_US
dc.identifier.citation	Anaheim, California, USA	en_US
dc.identifier.clearanceno	96-1729	en_US
dc.identifier.uri	http://hdl.handle.net/2014/27672
dc.description.abstract	Ball grid arrays (BGAs), and other area array packages, are becoming more prominent as a way to increase component pin count while avoiding the manufacturing difficulties inherent in processing quad flat packs (QFPs)...Cleaning printed wiring assemblies (PWAs) with BGA components mounted on the surface is problematic...Currently, a low flash point semi-aqueous material, in conjunction with a batch cleaning unit, is being used to clean PWAs. The approach taken at JPL was to investigate the use of (1) semi-aqueous materials having a high flash point and (2) aqueous cleaning involving a saponifier.	en_US
dc.format.extent	534284 bytes
dc.format.mimetype	application/pdf
dc.language.iso	en_US
dc.subject.other	ball grid array area array package semi-aqueous cleaning flash point aqueous/saponifier cleaning design of experiment DOE Taguchi DOE TDOE wuality characteristics output characteristics ionic contamination testing ionic residue rosin residue	en_US
dc.title	Taguchi Experimental Design for Cleaning PWAs with Ball Grid Arrays	en_US