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Taguchi Experimental Design for Cleaning PWAs with Ball Grid Arrays

Show simple item record Bonner, J.K. en_US Mehta, A. en_US Walton, S. en_US 2004-10-01T06:15:25Z 2004-10-01T06:15:25Z 1997-02-25 en_US
dc.identifier.citation Anaheim, California, USA en_US
dc.identifier.clearanceno 96-1729 en_US
dc.description.abstract Ball grid arrays (BGAs), and other area array packages, are becoming more prominent as a way to increase component pin count while avoiding the manufacturing difficulties inherent in processing quad flat packs (QFPs)...Cleaning printed wiring assemblies (PWAs) with BGA components mounted on the surface is problematic...Currently, a low flash point semi-aqueous material, in conjunction with a batch cleaning unit, is being used to clean PWAs. The approach taken at JPL was to investigate the use of (1) semi-aqueous materials having a high flash point and (2) aqueous cleaning involving a saponifier. en_US
dc.format.extent 534284 bytes
dc.format.mimetype application/pdf
dc.language.iso en_US
dc.subject.other ball grid array area array package semi-aqueous cleaning flash point aqueous/saponifier cleaning design of experiment DOE Taguchi DOE TDOE wuality characteristics output characteristics ionic contamination testing ionic residue rosin residue en_US
dc.title Taguchi Experimental Design for Cleaning PWAs with Ball Grid Arrays en_US

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