dc.contributor.author |
Cornford, Steven L. |
en_US |
dc.contributor.author |
Gibbel, Mark |
en_US |
dc.date.accessioned |
2004-09-30T23:19:45Z |
|
dc.date.available |
2004-09-30T23:19:45Z |
|
dc.date.issued |
1996-10-22 |
en_US |
dc.identifier.citation |
Anaheim, CA |
en_US |
dc.identifier.clearanceno |
96-1352 |
en_US |
dc.identifier.uri |
http://hdl.handle.net/2014/26476 |
|
dc.description.abstract |
Physics of failure approaches have gained wide spread acceptance within the electronic reliability community. These methodologies involve identifying root cause failure mechanisms, developing associated models, and utilizing these models to inprove time to market, lower development and build costs and higher reliability. The methodology outlined herein sets forth a process, based on integration of both physics and engineering principles, for achieving the same goals. |
en_US |
dc.format.extent |
199441 bytes |
|
dc.format.mimetype |
application/pdf |
|
dc.language.iso |
en_US |
|
dc.subject.other |
failure analysis electronics reliability PACT (prevention analysis control or test) defect detection and prevention (DDP) |
en_US |
dc.title |
Methodology for Physics and Engineering of Reliable Products |
en_US |