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CSP/BGA Board level Reliability

CSP/BGA Board level Reliability

Ghaffarian, R.
URI: http://hdl.handle.net/2014/22990
Date: 1998-03-01
Citation: Anaheim, California, USA

Abstract:

Different aspects of advanced surface mount package technology have been investigated for aerospace applications. Three key areas included the assembly reliability of conventional Surface Mount, Ball Grid Arrays (BGAs), and Chip Scale Packages.

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