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A Review and Prediction of Chip Scale Solder Joint Reliability

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dc.contributor.author Ghaffarian, Reza en_US
dc.date.accessioned 2004-09-26
dc.date.available 2004-09-26
dc.date.issued 1997-10-12 en_US
dc.identifier.citation Philadelphia, PA, USA en_US
dc.identifier.clearanceno 97-0737 en_US
dc.identifier.uri http://hdl.handle.net/2014/22265
dc.description.abstract Availability of board level solder joint reliability information is critical to the acceptance of CSPs as alternative packages. This paper will review different CSPs as well as their assembly reliability. en_US
dc.format.extent 83514 bytes
dc.format.mimetype application/pdf
dc.language.iso en_US
dc.subject.other Chip Scale solder joint en_US
dc.title A Review and Prediction of Chip Scale Solder Joint Reliability en_US


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