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A Review and Prediction of Chip Scale Solder Joint Reliability
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A Review and Prediction of Chip Scale Solder Joint Reliability
Ghaffarian, Reza
URI:
http://hdl.handle.net/2014/22265
Date:
1997-10-12
Citation:
Philadelphia, PA, USA
Abstract:
Availability of board level solder joint reliability information is critical to the acceptance of CSPs as alternative packages. This paper will review different CSPs as well as their assembly reliability.
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JPL TRS 1992+
JPL TRS 1992+
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