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A Review and Prediction of Chip Scale Solder Joint Reliability

A Review and Prediction of Chip Scale Solder Joint Reliability

Ghaffarian, Reza
URI: http://hdl.handle.net/2014/22265
Date: 1997-10-12
Citation: Philadelphia, PA, USA

Abstract:

Availability of board level solder joint reliability information is critical to the acceptance of CSPs as alternative packages. This paper will review different CSPs as well as their assembly reliability.

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