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High Temperature, High Reliability Integrated Hybrid Packaging for Radiation Hardened Spacecraft Micromachined Tunneling Accelerometer

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dc.contributor.author Boyadzhyan, V. V. en_US
dc.contributor.author Choma, J. en_US
dc.date.accessioned 2004-09-25
dc.date.available 2004-09-25
dc.date.issued 1998-09-17 en_US
dc.identifier.citation IEEE International Workshop en_US
dc.identifier.citation Chicago, IL, U.S.A. en_US
dc.identifier.clearanceno 98-1389 en_US
dc.identifier.uri http://hdl.handle.net/2014/20428
dc.description.abstract This paper summarizes and reports a radiation hardened spacecraft high temperature, high reliability Sensor/Circut Integrated Packaging Technology. en_US
dc.format.extent 507169 bytes
dc.format.mimetype application/pdf
dc.language.iso en_US
dc.subject.other radiation hardened high temperature tunneling accelerator packaging en_US
dc.title High Temperature, High Reliability Integrated Hybrid Packaging for Radiation Hardened Spacecraft Micromachined Tunneling Accelerometer en_US


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