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Review of Stack CSP Technologies

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dc.contributor.author Ghaffarian, R. en_US
dc.date.accessioned 2004-09-24T16:27:03Z
dc.date.available 2004-09-24T16:27:03Z
dc.date.issued 1999-08-12 en_US
dc.identifier.citation Chip Scale International Symposium en_US
dc.identifier.citation San Jose, California, USA en_US
dc.identifier.clearanceno 99-1265 en_US
dc.identifier.uri http://hdl.handle.net/2014/17815
dc.description.abstract CSP is an emerging technology with significant potential growth in stacking. Many of the stacking techniques for conventional packages could be implemented for CSP once materials, process, and system development for finer features are developed. en_US
dc.format.extent 659351 bytes
dc.format.mimetype application/pdf
dc.language.iso en_US
dc.subject.other 3D CSP stack CSP Chip Scale Package MCM Mulitchip Package en_US
dc.title Review of Stack CSP Technologies en_US


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