Review of Stack CSP Technologies

Ghaffarian, R.

dc.contributor.author	Ghaffarian, R.	en_US
dc.date.accessioned	2004-09-24T16:27:03Z
dc.date.available	2004-09-24T16:27:03Z
dc.date.issued	1999-08-12	en_US
dc.identifier.citation	Chip Scale International Symposium	en_US
dc.identifier.citation	San Jose, California, USA	en_US
dc.identifier.clearanceno	99-1265	en_US
dc.identifier.uri	http://hdl.handle.net/2014/17815
dc.description.abstract	CSP is an emerging technology with significant potential growth in stacking. Many of the stacking techniques for conventional packages could be implemented for CSP once materials, process, and system development for finer features are developed.	en_US
dc.format.extent	659351 bytes
dc.format.mimetype	application/pdf
dc.language.iso	en_US
dc.subject.other	3D CSP stack CSP Chip Scale Package MCM Mulitchip Package	en_US
dc.title	Review of Stack CSP Technologies	en_US