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CSP Assembly Reliability

CSP Assembly Reliability

Ghaffarian, R.
URI: http://hdl.handle.net/2014/17806
Date: 1999-07
Citation: Area Array Interconnection Handbook
USA

Abstract:

Reviews the many factors that affect interconnect reliability of emerging chip scale package (CSP) assemblies. These include: package type, package build, board design, and assembly variables.

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