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CSP Assembly Reliability
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CSP Assembly Reliability
Ghaffarian, R.
URI:
http://hdl.handle.net/2014/17806
Date:
1999-07
Citation:
Area Array Interconnection Handbook
USA
Abstract:
Reviews the many factors that affect interconnect reliability of emerging chip scale package (CSP) assemblies. These include: package type, package build, board design, and assembly variables.
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JPL TRS 1992+
JPL TRS 1992+
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