JPL Technical Report Server

Manufacturing Robustness of CSP in SMT Line

Manufacturing Robustness of CSP in SMT Line

Ghaffarian, R.; Chen, A.; Romas, N.; Bragg, J.; Quan, C.; Smith, M.; Sterian, I.
URI: http://hdl.handle.net/2014/17725
Date: 1999-12-16
Citation: SMTA, International CSP Symposium
San Jose, California, USA

Abstract:

In this paper, the assembly process flow, solder paste for different stencil design, manufacturing defects, X-ray inspection results, and ultrasonic characterizations are reported.

Show full item record

Items in TRS are protected by copyright, but are furnished with U.S. government purpose use rights.

Files in this item

Thumbnail
Name: 99-1163.pdf
Size: 725.8Kb
Format: PDF
View/Open

This item appears in the following Collection(s)

Search


Browse

My Account