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A 90 GHz Amplifier Assembled Using a Bump-Bonded InP-based HEMT
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A 90 GHz Amplifier Assembled Using a Bump-Bonded InP-based HEMT
Samoska, L.
;
Pinsukanjana, P.
;
Gaier, T.
;
Smith, R.
;
Ksendzov, A.
;
Fitzsimmons, M.
;
Martin, S.
URI:
http://hdl.handle.net/2014/17403
Date:
1999-10-17
Citation:
IEEE, GaAs Integrated Circuit Symposium
Monterey, California, USA
Abstract:
We report on the performance of a novel W-band amplifier fabricated utilizing very compact bump bonds.
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JPL TRS 1992+
JPL TRS 1992+
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