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Integrated Avionics System (IAS), Integrating 3-D Technology on a Spacecraft Panel

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dc.contributor.author Hunter, D. en_US
dc.date.accessioned 2004-09-23T23:28:31Z
dc.date.available 2004-09-23T23:28:31Z
dc.date.issued 1999-04-07 en_US
dc.identifier.citation International Conference & Exhibition on High Density Packaging & MCM en_US
dc.identifier.citation Denver, Colorado, USA en_US
dc.identifier.clearanceno 99-0553 en_US
dc.identifier.uri http://hdl.handle.net/2014/17130
dc.description.abstract As spacecraft designs converge toward miniaturization, and with the volumetric and mass challenges placed on avionics, programs will continue to advance the state of the art in spacecraft system development with new challenges to reduce power, mass and volume. en_US
dc.format.extent 769127 bytes
dc.format.mimetype application/pdf
dc.language.iso en_US
dc.subject.other IAS HMC horizontal mounted cube 3D technology avionics en_US
dc.title Integrated Avionics System (IAS), Integrating 3-D Technology on a Spacecraft Panel en_US


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