JPL Technical Report Server

Impact of print parameters and CSP pitch and I/O on paste quality and volume

Show simple item record

dc.contributor.author Achong, C. en_US
dc.contributor.author Vogler, O. en_US
dc.contributor.author Phillips, D. en_US
dc.contributor.author Chen, A. en_US
dc.contributor.author Ghaffarian, R. en_US
dc.date.accessioned 2004-09-23T21:08:05Z
dc.date.available 2004-09-23T21:08:05Z
dc.date.issued 2000-07-12 en_US
dc.identifier.citation Surface Mount International en_US
dc.identifier.citation Chicago, Illinois, USA en_US
dc.identifier.clearanceno 00-1574 en_US
dc.identifier.uri http://hdl.handle.net/2014/15820
dc.description.abstract This paper presents the effects of paste printing parameters including stencil thickness, squeegee length and materials, and pressurized head on solder paste volume. en_US
dc.format.extent 795113 bytes
dc.format.mimetype application/pdf
dc.language.iso en_US
dc.subject.other SMT BGA chip scale package CSP assembly aspect ratio en_US
dc.title Impact of print parameters and CSP pitch and I/O on paste quality and volume en_US


Files in this item

This item appears in the following Collection(s)

Show simple item record

Search


Browse

My Account