Thermal cycling test results of CSP and RF assemblies

Ghaffarian, R.; Nelson,  G.; Cooper,  M.; Lam,  D.; Strudler,  S.; Umdekar,  A.; Selk,  K.; Bjorndahl,  B.; Duprey,  R.

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Thermal cycling test results of CSP and RF assemblies

Ghaffarian, R.; Nelson, G.; Cooper, M.; Lam, D.; Strudler, S.; Umdekar, A.; Selk, K.; Bjorndahl, B.; Duprey, R.

URI: http://hdl.handle.net/2014/15782

Date: 2000-07-10

Citation: Surface Mount International
Chicago, Illinois, USA

Abstract:

A JPL-led chip scale package (CSP) Consortium of enterprises, composed of representing agencies and private companies, recently joined together to pool in-kind resources for developing the quality and reliability of chip scale packages (CSPs) for a variety of projects.

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