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Copper Metallization - Can We Trust It?

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dc.contributor.author Lloyd, J. en_US
dc.date.accessioned 2004-09-23T19:44:37Z
dc.date.available 2004-09-23T19:44:37Z
dc.date.issued 2000-05-22 en_US
dc.identifier.citation Electronic Parts and Packaging for Space and Aeronautic Applications Advanced Technology Workshop en_US
dc.identifier.citation Pasadena, CA, USA en_US
dc.identifier.clearanceno 00-1078 en_US
dc.identifier.uri http://hdl.handle.net/2014/15071
dc.format.extent 735974 bytes
dc.format.mimetype application/pdf
dc.language.iso en_US
dc.subject.other copper metallization electromigration reliability en_US
dc.title Copper Metallization - Can We Trust It? en_US


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