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Reliability Challenges in Emerging IC Metallization Technologies
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Reliability Challenges in Emerging IC Metallization Technologies
Lloyd, J.
URI:
http://hdl.handle.net/2014/14091
Date:
2000-03-20
Citation:
ESCCON 2000 European Space Components Conference
Noordwijk, Netherlands
Abstract:
Submicron metallization has been a mixed blessing.
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JPL TRS 1992+
JPL TRS 1992+
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