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Challenges in Interconnection and Packaging of Microelectromechanical Systems (MEMS)
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| dc.contributor.author | Rameshan, R. | en_US |
| dc.contributor.author | Ghaffarian, R. | en_US |
| dc.date.accessioned | 2004-09-23T17:29:19Z | |
| dc.date.available | 2004-09-23T17:29:19Z | |
| dc.date.issued | 2000-05-22 | en_US |
| dc.identifier.citation | 50th ECTC Conference | en_US |
| dc.identifier.citation | Las Vegas, NV, USA | en_US |
| dc.identifier.clearanceno | 00-0242 | en_US |
| dc.identifier.uri | http://hdl.handle.net/2014/13868 | |
| dc.description.abstract | Integrated circuit packaging and their testing is well advanced because of the maturity of the IC industry, their wide applications, and availability of industrial infrastructure. | en_US |
| dc.format.extent | 1266994 bytes | |
| dc.format.mimetype | application/pdf | |
| dc.language.iso | en_US | |
| dc.subject.other | COTS MEMS packaging interconnections reliability | en_US |
| dc.title | Challenges in Interconnection and Packaging of Microelectromechanical Systems (MEMS) | en_US |
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JPL TRS 1992+
JPL TRS 1992+