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Challenges in Interconnection and Packaging of Microelectromechanical Systems (MEMS)

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dc.contributor.author Rameshan, R. en_US
dc.contributor.author Ghaffarian, R. en_US
dc.date.accessioned 2004-09-23T17:29:19Z
dc.date.available 2004-09-23T17:29:19Z
dc.date.issued 2000-05-22 en_US
dc.identifier.citation 50th ECTC Conference en_US
dc.identifier.citation Las Vegas, NV, USA en_US
dc.identifier.clearanceno 00-0242 en_US
dc.identifier.uri http://hdl.handle.net/2014/13868
dc.description.abstract Integrated circuit packaging and their testing is well advanced because of the maturity of the IC industry, their wide applications, and availability of industrial infrastructure. en_US
dc.format.extent 1266994 bytes
dc.format.mimetype application/pdf
dc.language.iso en_US
dc.subject.other COTS MEMS packaging interconnections reliability en_US
dc.title Challenges in Interconnection and Packaging of Microelectromechanical Systems (MEMS) en_US


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