Reliability Issues in Deep Submicron Metallization

dc.contributor.author	Lloyd, J.	en_US
dc.date.accessioned	2004-09-23T17:22:48Z
dc.date.available	2004-09-23T17:22:48Z
dc.date.issued	2000-01-27	en_US
dc.identifier.citation	Nanospace 2000	en_US
dc.identifier.citation	Houston, TX, USA	en_US
dc.identifier.clearanceno	00-0137	en_US
dc.identifier.uri	http://hdl.handle.net/2014/13767
dc.description.abstract	Submicron metallization has been a mixed blessing.	en_US
dc.format.extent	498267 bytes
dc.format.mimetype	application/pdf
dc.language.iso	en_US
dc.subject.other	Electromigration Copper Reliability	en_US
dc.title	Reliability Issues in Deep Submicron Metallization	en_US