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Reliability Issues in Deep Submicron Metallization

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dc.contributor.author Lloyd, J. en_US
dc.date.accessioned 2004-09-23T17:22:48Z
dc.date.available 2004-09-23T17:22:48Z
dc.date.issued 2000-01-27 en_US
dc.identifier.citation Nanospace 2000 en_US
dc.identifier.citation Houston, TX, USA en_US
dc.identifier.clearanceno 00-0137 en_US
dc.identifier.uri http://hdl.handle.net/2014/13767
dc.description.abstract Submicron metallization has been a mixed blessing. en_US
dc.format.extent 498267 bytes
dc.format.mimetype application/pdf
dc.language.iso en_US
dc.subject.other Electromigration Copper Reliability en_US
dc.title Reliability Issues in Deep Submicron Metallization en_US


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