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High frequency electromagnetic techniques: a new tool for electronic packaging

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dc.contributor.author Budraa, N. K. en_US
dc.contributor.author Barmatz, M. en_US
dc.date.accessioned 2004-09-22T23:39:47Z
dc.date.available 2004-09-22T23:39:47Z
dc.date.issued 2001-05-15 en_US
dc.identifier.citation The Second Annual NASA Electronics Parts and Packaging Program Conference en_US
dc.identifier.citation Pasadena, California, USA en_US
dc.identifier.clearanceno 01-1083 en_US
dc.identifier.uri http://hdl.handle.net/2014/12793
dc.format.extent 39027 bytes
dc.format.mimetype application/pdf
dc.language.iso en_US
dc.subject.other high frequency electronic packaging reliability en_US
dc.title High frequency electromagnetic techniques: a new tool for electronic packaging en_US


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