JPL Technical Report Server

Integrated Avionics System (IAS), integrating 3-D technology on a spacecraft panel

Show simple item record

dc.contributor.author Hunter, D. J. en_US
dc.date.accessioned 2004-09-22T22:25:17Z
dc.date.available 2004-09-22T22:25:17Z
dc.date.issued 2002-03-09 en_US
dc.identifier.citation IEEE Aerospace Conference en_US
dc.identifier.citation Big Sky, MN, USA en_US
dc.identifier.clearanceno 01-0241 en_US
dc.identifier.uri http://hdl.handle.net/2014/12257
dc.description.abstract A novel system packaging approach incorporates solutions that provide broader environmental applications, more flexible system interconnectivity, scalability, and simplified assembly test and integration schemes. en_US
dc.format.extent 756937 bytes
dc.format.mimetype application/pdf
dc.language.iso en_US
dc.subject.other avionics 3-D technology en_US
dc.title Integrated Avionics System (IAS), integrating 3-D technology on a spacecraft panel en_US


Files in this item

This item appears in the following Collection(s)

Show simple item record

Search


Browse

My Account