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Reliability of CSP assemblies with underfill subjected to 4,000 extreme temperature cycles

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dc.contributor.author Ghafarian, R. en_US
dc.date.accessioned 2004-09-22T22:03:46Z
dc.date.available 2004-09-22T22:03:46Z
dc.date.issued 2002-05-08 en_US
dc.identifier.citation IMAPS Southern California en_US
dc.identifier.citation Pasadena, CA, USA en_US
dc.identifier.clearanceno 02-0944 en_US
dc.identifier.uri http://hdl.handle.net/2014/12090
dc.format.extent 393220 bytes
dc.format.mimetype application/pdf
dc.language.iso en_US
dc.subject.other chip scale package CSP area array package microvia thermal cycle solder joint reliability en_US
dc.title Reliability of CSP assemblies with underfill subjected to 4,000 extreme temperature cycles en_US


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