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Flip chip packaging of a MEMS neuro-prosthetic system

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dc.contributor.author Castillo, L. del en_US
dc.contributor.author Graber, R. en_US
dc.contributor.author D'Agostino, S. en_US
dc.contributor.author Mojarradi, M. en_US
dc.contributor.author Mottiwala, A. en_US
dc.date.accessioned 2004-09-22T21:30:00Z
dc.date.available 2004-09-22T21:30:00Z
dc.date.issued 2002-03-10 en_US
dc.identifier.citation International Conference on Advanced Packaging Systems en_US
dc.identifier.citation Reno, NV, USA en_US
dc.identifier.clearanceno 02-0106 en_US
dc.identifier.uri http://hdl.handle.net/2014/11592
dc.description.abstract A joint research team from California Institute of Technology and Jet Propulsion Laboratory is developing a fully miniaturized, smart implantable neuro-prosthetic system, by combining integrated electronics with Micro Electro Mechanical Structure (MEMS) based electrode arrays. The packaging group of this project team has been tasked with designing and fabricating a package to interface electrically between a MEMS electrode array, capable of extracting signals from brain, and an electronic chip, capable of providing on chip conditioning/processing of extracted data, while delivering the output data to a detector located outside the body. en_US
dc.format.extent 3585156 bytes
dc.format.mimetype application/pdf
dc.language.iso en_US
dc.subject.other flip chip MEMS neuro-prosthetic soldering biocompatibility en_US
dc.title Flip chip packaging of a MEMS neuro-prosthetic system en_US


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