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Choosing the right lead-free solder for hi-rel printed wiring assemblies

Choosing the right lead-free solder for hi-rel printed wiring assemblies

Bonner, J. K.; Castillo, L. del; Mehta, A.
URI: http://hdl.handle.net/2014/11269
Date: 2003-05-11
Citation: SAMPE: Society for the Advancement of Material and Process Engineering
Long Beach, CA, USA

Abstract:

This paper presents data collected from a recent NASA project that focuses specifically on finding suitable altematives to eutectic tin-lead solders, especially in solder paste applications.

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